Once the sample plane is obtained, it is glued onto the slide. The slides used can be polished, if duly calibrated, or prepared to the desired thickness by means of the MICROMET equipped with the GRINDING device or the REMET THINNING SYSTEM with micrometric drum.
The bonding must be done very carefully, the air bubbles between the two surfaces must be completely eliminated and the contact must also be checked. The choice of resin is fundamental, it must have excellent adhesive properties. The device for bonding mineralogical samples is composed of a robust structure with 4 spring pressers and relative plastic pressure disks. This equipment allows to obtain perfectly parallel bondings, with a minimum and constant resin thickness. Bonding can be accelerated by means of a heating plate with adjustable temperature.
